FA10 Series

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0.5mm pitch, 0.9mm overall height FPC connector

Outline
 The FA10 Series is a 0.5mm pitch, top and bottom-surface connection type, one-action LIF* insertion FPC connector ideally suited for saving space in mobile devices.

Features
- Space saving FPC connector with 0.5mm pitch, 0.9mm overall height, 3.2mm depth.
- Applicable FPC thickness 0.2 +/- 0.03mm, top and bottom-surface connection type, LIF structure (non-sliding point of contact).
- Guides for FPC sides for friction lock and prevention of misalignment.
- One-action mating, with no need for actuator or slider operation during insertion and removal.
- Tapered guides in the insertion area for improved FPC insertion guidance.
- Board pattern traces are possible under the connector, excluding terminal areas.
- Terminals at both front and back improve board retention strength.
- Lead-free, halogen-free compliant product.
- Nickel barrier prevents solder wicking.

  * LIF: (Low Insertion Force)

General Specifications

# of contacts4, 5, 6 positions: Now in mass-production
10 positions: Samples available
8 positions: Development scheduled
Pitch0.5 mm one row alignment
CurrentDC 0.5 A/ terminal
Rated voltageAC, DC 50 V/ terminal
Contact resistance70 milliohm max.
Applicable FPC thickness0.2+/-0.03 mm
Dielectric withstanding voltageAC 250 Vr.m.s. (1 minute)
Operating temperature range-40 deg. C to +85 deg. C
Durability20 mating cycles

Product ListShow allCustomize

Status RoHS compliant REACH compliant Connector types Number of contacts Pitch (mm) PCB mounting method Staggered pattern PCB boardlock feature Material of contact Finish of contact in connecting area Finish of contact in PCB mounting area Material of housing Color of housing Applicable FPC thickness (mm) Remarks on applicable FPC ZIF/ Non-ZIF PCB mounted height (mm) FPC entry angle Operating temperature range (deg. C) Rated current (A) Dielectric withstanding voltage (VACr.m.s. 1minute) Insulation resistance (megohm min.) Contact resistance (milliohm max.) Packing type Quantity in the standard packing Body length (mm) Body breadth (mm) Body height (mm) Mounting height (mm) Remarks
Active Yes 4 0.5 Surface mounted FALSE Copper Alloy Partial Gold plating over Nickel Partial Gold plating over Nickel Heat-resistant resin Black 0.2 +/-0.03 LIF Top and bottom-surface connection -40 to +85 0.5 250 70 Supplied in embossed tape 8000 3.5 3.2 0.9
Active Yes 5 0.5 Surface mounted FALSE Copper Alloy Partial Gold plating over Nickel Partial Gold plating over Nickel Heat-resistant resin Black 0.2 +/-0.03 LIF Top and bottom-surface connection -40 to +85 0.5 250 70 Supplied in embossed tape 8000 4.0 3.2 0.9
Active Yes 6 0.5 Surface mounted FALSE Copper Alloy Partial Gold plating over Nickel Partial Gold plating over Nickel Heat-resistant resin Black 0.2 +/-0.03 LIF Top and bottom-surface connection -40 to +85 0.5 250 70 Supplied in embossed tape 8000 4.5 3.2 0.9

Notice


Status RoHS compliant REACH compliant
Connector types Number of contacts Pitch (mm)
PCB mounting method Staggered pattern PCB boardlock feature
Material of contact Finish of contact in connecting area Finish of contact in PCB mounting area
Material of housing Color of housing Applicable FPC thickness (mm)
Remarks on applicable FPC ZIF/ Non-ZIF PCB mounted height (mm)
FPC entry angle Operating temperature range (deg. C) Rated current (A)
Dielectric withstanding voltage (VACr.m.s. 1minute) Insulation resistance (megohm min.) Contact resistance (milliohm max.)
Packing type Quantity in the standard packing Body length (mm)
Body breadth (mm) Body height (mm) Mounting height (mm)
Remarks