FB8 Series

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0.3mm pitch FPC connector, upper contact
Overview
 The FB8 series are upper contact 0.3mm pitch one-touch FPC connectors for compact and small information communication devices such as, mobile PCs, PDAs, LCDs and mobile phones.

Features
 - Upper surface contact 0.3mm pitch one-touch FPC connector.
 - Easy actuator operation due to rotation mechanism.
 - Supply of SMT type for automatic mounting with embossed tape.
 - Connector with 4.3mm depth and 1.2mm height.
   Longitudinal (0.3*(N-1)+1.6)mm, low profile product. (N= Number of positions)
 - Contact with solder wicking countermeasure.

General Specifications

Number of positions17, 23, 25, 29, 31, 33, 35, 39, 41, 45, 51
Current0.35 A
Rated voltageAC, DC each 50 V/ contact
Contact resistance20 milliohm max.
Insulation resistance100 megohm min.
Dielectric withstanding voltage250 VACr.m.s. (1 minute)
Pitch0.3 mm staggered pitch
Operating temperature range-40 deg. C to +85 deg. C
Applicable FPC0.3 mm pitch,
0.2 ± 0.03 mm thickness with reinforcement
Durability20 times

Product ListShow allCustomize

Status RoHS compliant REACH compliant Applicable FPC conductor spacing Number of contacts Connector types PCB mounting method Material of contact Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator Color of insulator Applicable FPC thickness Remarks on applicable FPC ZIF/ Non-ZIF PCB mounted height FPC entry angle Operating temperature range Rated current Dielectric withstanding voltage Insulation resistance Contact resistance Staggered pattern PCB boardlock feature Packing type Quantity in the standard packing Body length Body breadth Body height Mounting height Remarks
Active Yes 0.3 mm 17 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 6.4 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 17 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 6.4 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 23 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 8.2 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 23 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 8.2 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 25 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 8.8 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 25 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right-angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 8.8 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 29 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 10.0 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 29 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 10.0 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 31 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 10.6 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 31 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 10.6 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 33 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 11.2 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 33 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 11.2 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 35 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 11.8 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 35 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 11.8 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 39 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 13.0 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 39 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 13.0 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 41 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 13.6 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 41 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 13.6 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 45 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 14.8 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 45 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 14.8 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 51 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None 16.6 mm 4.95 mm 1.2 mm 1.2 mm
Active Yes 0.3 mm 51 Standard mounting type Soldering (SMT) Copper alloy Gold plating Gold flash plating Synthetic resin (UL94-V0) Beige 0.2 mm Bare traces should be given gold plating. ZIF 1.2 mm Right angle (Upper-side contact) -40 deg. C to +85 deg. C 0.35 A AC 250 Vr.m.s. (1minute) 100 megohm min. 20 milliohm max. TRUE None Embossed-taped supply 2000 pieces/reel 16.6 mm 4.95 mm 1.2 mm 1.2 mm

Notice


Status RoHS compliant REACH compliant
Applicable FPC conductor spacing Number of contacts Connector types
PCB mounting method Material of contact Finish of contact in connecting area
Finish of contact in PCB mounting area Material of insulator Color of insulator
Applicable FPC thickness Remarks on applicable FPC ZIF/ Non-ZIF
PCB mounted height FPC entry angle Operating temperature range
Rated current Dielectric withstanding voltage Insulation resistance
Contact resistance Staggered pattern PCB boardlock feature
Packing type Quantity in the standard packing Body length
Body breadth Body height Mounting height
Remarks