WP21 Series

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0.35mm pitch, Stacking type board-to-board (FPC) connector
Outline:
 The WP21 Series is a space-saving low-profile stacking type board-to-board (FPC) connector with 0.35 mm pitch spacing that is ideal for high-density mounting in slim and compact information communication devices like mobile phones, and smartphones.
The WP21 achieves to minimize more than 10% mounting space compared to our existing product (WP9 Series) and contributes to save board space and also enhances design flexibility for customers.

Features:
- 0.35mm pitch, 2rows, 0.6mm stacking height.
- 2-point contact design to resist twisting stress.
- Improved workability for customers with a clear click feeling.
- Contact structure ensures high wear-resistance and high contact reliability.
- Lead-free. (Nickel barrier on contact prevents solder wicking.)

Applications:
Mobile phones, smartphones, tablet PC, notebook PC, compact LCD displays, digital still cameras, digital video cameras, and other compact hand-held devices.

General Specifications

# of contacts10, 20, 22, 24, 30, 34, 40, 42, 46, 54 pos.
Pitch0.35 mm, 2 rows
CurrentAC, DC 0.3 A/ terminal
Rated voltageAC, DC 50 V
Contact resistance70 milliohm max. (initial)
Insulation resistance100 megohm min. (initial)
Dielectric withstanding voltage250 VACr.m.s. (1 minute)
Total insertion force1.5*n N max. (n: No. of pos.)
Total extraction force0.15*n N min. (n: No. of pos.)
Durability mating cycles30 mating cycles
Operating temperature range-40 deg. C to +85 deg. C

Product ListShow allCustomize

Status RoHS compliant REACH compliant Contact pitch No. of positions Plug/ Receptacle Number of rows Connection type PCB mounting method Rated current (AC, DC) Rated voltage Contact resistance (initial) Dielectric withstanding voltage Insulation resistance (initial) Material of contact Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator PCB boardlock feature Life time Total insertion force Total extraction force Body length Body breadth Body height Packing type Quantity in the standard packing Operating temperature range Remarks
Active Yes 0.35 mm pitch 10 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 15 N max. 1.5 N min. 2.81 mm 1.81 mm 0.49 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 20 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 30 N max. 3 N min. 4.56 mm 1.81 mm 0.49 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 24 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 36 N max. 3.6 N min.. 5.26 mm 1.81 mm 0.49 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 30 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 45 N max. 4.5 N min.. 6.31 mm 1.81 mm 0.49 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 34 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 51 N max. 5.1 N min.. 7.01 mm 1.81 mm 0.49 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 40 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 60 N max. 6 N min.. 8.06 mm 1.81 mm 0.49 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 42 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 63 N max. 6.3 N min. 8.41 mm 1.81 mm 0.49 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 46 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 69 N max. 6.9N max. 9.11 mm 1.81 mm 0.49 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 54 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 81 N max. 8.1 N min. 10.51 mm 1.81 mm 0.49 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 10 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 15 N max. 1.5 N min. 3.90 mm 1.95 mm 0.6 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 20 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 30 N max. 3 N min. 5.65 mm 1.95 mm 0.6 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 24 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 36 N max. 3.6 N min.. 6.35 mm 1.95 mm 0.6 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 30 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 45 N max. 4.5 N min.. 7.40 mm 1.95 mm 0.6 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 34 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 51 N max. 5.1 N min.. 8,10 mm 1.95 mm 0.6 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 40 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 60 N max. 6 N min.. 9.15 mm 1.95 mm 0.6 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 42 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 63 N max. 6.3 N min. 9.50 mm 1.95 mm 0.6 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 46 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 69 N max. 6.9N max. 10.20 mm 1.95 mm 0.6 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 54 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 81 N max. 8.1 N min. 11.60 mm 1.95 mm 0.6 mm Embossed tape packaging 8000 pieces/reel -40 deg. C to +85 deg. C

Notice


Status RoHS compliant REACH compliant
Contact pitch No. of positions Plug/ Receptacle
Number of rows Connection type PCB mounting method
Rated current (AC, DC) Rated voltage Contact resistance (initial)
Dielectric withstanding voltage Insulation resistance (initial) Material of contact
Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator
PCB boardlock feature Life time Total insertion force
Total extraction force Body length Body breadth
Body height Packing type Quantity in the standard packing
Operating temperature range Remarks