WP25D Series

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0.35mm pitch, Stacking type board-to-board (FPC) connector
Outline
 The WP25D Series is a 0.35 mm pitch spacing low-profile stacking type board-to-board (FPC) connector with terminals for power supply that is ideal for high-density mounting in slim and compact information communication devices like mobile phones, and smartphones.
The WP25D Series saves board space and enhances design flexibility by equipping high-current terminals that help to minimize the number of terminals typically required in standard connectors.

Features
- 0.35mm pitch, 2rows, 0.7mm stacking height.
- Two terminals for power supply compatible with 3.0A.
- 2-point contact design to resist twisting stress.
- Improved workability for customers with a clear click feeling.
- Contact structure ensures high wear-resistance and high contact reliability.
- Lead-free. (Nickel barrier on contact prevents solder wicking.)
- Signal contact supports 10 Gbps transmission rate.
- Supports MIPI, USB3.1 Gen2, and PCIe Gen3 transmission.

Applications
 Mobile phones, smartphones, tablet PC, notebook PC, compact LCD displays, digital still cameras, digital video cameras, and other compact hand-held devices.

General Specifications

# of contacts10, 28, 38 pos.
Pitch0.35 mm, 2 rows
CurrentSignal terminal: AC, DC 0.3 A/ terminal
Power terminal: AC, DC 3.0 A/ terminal
Rated voltageAC, DC 50 V
Contact resistanceSignal terminal: 70 milliohm max. (initial)
Power terminal: 20 milliohm max. (initial)
Insulation resistance100 megohm min. (initial)
Dielectric withstanding voltageAC 250 Vr.m.s. for 1 minute
Total insertion force1.5N x (n+4) max. (n: No. of pos.)
Total extraction force1.5N x (n+4) max. (n: No. of pos.)
Life Time30 mating cycles
Operating temperature range-40 deg. C to +85 deg. C
0.35mm pitch, Stacking type board-to-board (FPC) connector

Technical Resources

Product ListShow allCustomize

Status RoHS compliant REACH compliant Contact pitch No. of positions Plug/ Receptacle Number of rows Connection type PCB mounting method Rated current (AC, DC A/terminal) Rated voltage Contact resistance (initial) Dielectric withstanding voltage Insulation resistance (initial) Material of contact Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator PCB boardlock feature Life time Total insertion force Total extraction force Body length Body breadth Body height Packing type Quantity in the standard packing Operating temperature range Remarks
Active Yes 0.35 mm pitch 10 pos. (Signal terminal, +2 power terminals) Plug 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 21 N max. 2.1 N min. 3.21 mm 1.81 mm 0.57 mm Embossed tape packaging 8,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 28 pos. (Signal terminal, +2 power terminals) Plug 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 48 N max. 4.8 N min. 6.36 mm 1.81 mm 0.57 mm Embossed tape packaging 8,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 38 pos. (Signal terminal, +2 power terminals) Plug 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 63 N max. 6.3 N min. 8.11 mm 1.81 mm 0.57 mm Embossed tape packaging 8,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 10 pos. (Signal terminal, +2 power terminals) Receptacle 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 21 N max. 2.1 N min. 4 mm 1.95 mm 0.7 mm Embossed tape packaging 8,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 28 pos. (Signal terminal, +2 power terminals) Receptacle 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 48 N max. 4.8 N min. 7.15 mm 1.95 mm 0.7 mm Embossed tape packaging 8,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 38 pos. (Signal terminal, +2 power terminals) Receptacle 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 63 N max. 6.3 N min. 8.90 mm 1.95 mm 0.7 mm Embossed tape packaging 8,000 pieces/reel -40 deg. C to +85 deg. C

Notice


Status RoHS compliant REACH compliant
Contact pitch No. of positions Plug/ Receptacle
Number of rows Connection type PCB mounting method
Rated current (AC, DC A/terminal) Rated voltage Contact resistance (initial)
Dielectric withstanding voltage Insulation resistance (initial) Material of contact
Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator
PCB boardlock feature Life time Total insertion force
Total extraction force Body length Body breadth
Body height Packing type Quantity in the standard packing
Operating temperature range Remarks