WP27D Series

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0.35mm pitch, Stacking type board-to-board (FPC) connector
Outline
 The WP27D Series is a 0.35 mm pitch low-profile stacking type board-to-board (FPC) connector with special hold downs that can be used as power supply terminals, and is ideal for high-density mounting in slim and compact information communication devices like smartphones. This product has a structure that adds protection to the mating surface to prevent damage to the insulator in case force is applied while connectors are misaligned. Also the hold-downs can be used as high-current terminals.
The WP27D Series saves board space and enhances design flexibility by reducing the number of terminals typically required in standard connectors.

Features
- 0.35 mm pitch, 2 rows, 0.7 mm stacking height.
- Two terminals for power supply compatible with 3.0 A each.
- Hold-down structure adds protection to the mating surface to prevent damage to the insulator. (Armored)
- 2-point contact design to resist twisting stress.
- Improved workability for customers with a clear click feeling.
- Contact structure ensures high wear-resistance and high contact reliability.
- Lead-free. (Nickel barrier on contact prevents solder wicking.)
- Signal contact supports 10 Gbps transmission rate.
- Supports MIPI, USB3.1 Gen2, and PCIe Gen3 transmission.

General Specifications

# of contacts10, 30, 34, 38, 40, 50 pos.
Pitch0.35 mm, 2 rows
CurrentSignal terminal: AC, DC 0.3 A/ terminal
Power terminal: AC, DC 3.0 A/ terminal
Rated voltageAC, DC 50 V
Contact resistanceSignal terminal: 70 milliohm max. (initial)
Hold-down for power supply: 20 milliohm max. (initial)
Insulation resistance100 megohm min. (initial)
Dielectric withstanding voltageAC 250 Vr.m.s. for 1 minute
Total insertion force1.5N x (n+4) max. (n: No. of pos.)
Total extraction force0.15N x n min. (n: No. of pos.)
Life time30 mating cycles
Operating temperature range-40 Deg. C to +85 Deg. C
0.35mm pitch, Stacking type board-to-board (FPC) connector

Technical Resources

Product ListShow allCustomize

Status RoHS compliant REACH compliant Contact pitch No. of positions Plug/ Receptacle Number of rows Connection type PCB mounting method Rated current (AC, DC A/terminal) Rated voltage Contact resistance (milliohm max. initial) Dielectric withstanding voltage Insulation resistance (initial) Material of contact Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator PCB boardlock feature Life time Total insertion force Total extraction force Body length Body breadth Body height Packing type Quantity in the standard packing Operating temperature range Remarks
Active Yes 0.35 mm pitch 10 pos. (Signal terminal, +2 power terminals) Plug 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 21 N max. 1.5 N min.. 3.57 mm 1.81 mm 0.57 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 30 pos. (Signal terminal, +2 power terminals) Plug 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 51 N max. 4.5 N min.. 7.07 mm 1.81 mm 0.57 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 34 pos. (Signal terminal, +2 power terminals) Plug 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 57 N max. 5.1 N min.. 7.77 mm 1.81 mm 0.57 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 38 pos. (Signal terminal, +2 power terminals) Plug 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 63 N max. 5.7 N min.. 8.47 mm 1.81 mm 0.57 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 40 pos. (Signal terminal, +2 power terminals) Plug 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 66 N max. 6.0 N min.. 8.82 mm 1.81 mm 0.57 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 50 pos. (Signal terminal, +2 power terminals) Plug 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 81 N max. 7.5 N min.. 10.57 mm 1.81 mm 0.57 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 10 pos. (Signal terminal, +2 power terminals) Receptacle 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 21 N max. 1.5 N min.. 4.30 mm 1.9 mm 0.7 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 30 pos. (Signal terminal, +2 power terminals) Receptacle 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 51 N max. 4.5 N min.. 7.80 mm 1.9 mm 0.7 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 34 pos. (Signal terminal, +2 power terminals) Receptacle 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 57 N max. 5.1 N min.. 8.50 mm 1.9 mm 0.7 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 38 pos. (Signal terminal, +2 power terminals) Receptacle 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 63 N max. 5.7 N min.. 9.20 mm 1.9 mm 0.7 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 40 pos. (Signal terminal, +2 power terminals) Receptacle 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 66 N max. 6.0 N min.. 9.55 mm 1.9 mm 0.7 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.35 mm pitch 50 pos. (Signal terminal, +2 power terminals) Receptacle 2 rows Stacking Soldering (SMT) 0.3 (Signal), 3.0 (Power) AC, DC 50 V 70 (Signal), 20 (Power) AC 250 Vr.m.s. 1 minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down (double as power contact) 30 mating cycles 81 N max. 7.5 N min.. 11.30 mm 1.9 mm 0.7 mm Embossed tape packaging 15,000 pieces/reel -40 deg. C to +85 deg. C

Notice


Status RoHS compliant REACH compliant
Contact pitch No. of positions Plug/ Receptacle
Number of rows Connection type PCB mounting method
Rated current (AC, DC A/terminal) Rated voltage Contact resistance (milliohm max. initial)
Dielectric withstanding voltage Insulation resistance (initial) Material of contact
Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator
PCB boardlock feature Life time Total insertion force
Total extraction force Body length Body breadth
Body height Packing type Quantity in the standard packing
Operating temperature range Remarks