WP6 Series

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0.4mm pitch stacking type board-to-board(FPC) connector
Outline
 The WP6 series is a low-profile board-to-board(FPC) connector with 0.4mm pitch spacing that is ideal for high-density mounting in slim information communication devices like mobile phones, smartphones, and notebook PCs.

Features
 0.4mm pitch, 2rows, stacking height 0.8mm.
 Contact structure ensures high wear-resistance and high contact reliability.
 Secure hold-downs prevent insulator breakage and peeling from FPC.
 2-point contact design to resist twisting stress.
 Lead-free. Nickel barrier on contact prevents solder wicking.

Applications
 Slim information communication devices like mobile phones, smartphones, and notebook PCs.

General Specifications

Number of positions10, 12, 16, 20, 24, 30, 40, 50 pos.
Pitch0.4 mm, 2 rows
CurrentAC, DC 0.3 A/ terminal
Rated voltageAC, DC 50 V
Contact resistance70 milliohm max. (initial)
Insulation resistance100 megohm min. (initial)
Dielectric withstanding voltage250 VACr.m.s. (1 minute)
Total insertion force1.5*n N max. (n: No. of pos.)
(less than 20 pos.) 2.5*n N max. (n: No. of pos.)
Total extraction force0.1*n N min. (n: No. of pos.)
(less than 20 pos.) 0.2*n N min. (n: No. of pos.)
Durability mating cycles30 mating cycles
Operating temperature range-40 deg. C to +85 deg. C

Product ListShow allCustomize

Status RoHS compliant REACH compliant Contact pitch No. of positions Plug/ Receptacle Number of rows Connection type PCB mounting method Rated current (AC, DC) Rated voltage Contact resistance (initial) Dielectric withstanding voltage Insulation resistance (initial) Material of contact Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator PCB boardlock feature Life time Total insertion force Total extraction force Body length Body breadth Body height Packing type Quantity in the standard packing Operating temperature range Remarks
Active Yes 0.4 mm pitch 10 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 15 N max. 1 N min. 3.35 mm 2 mm 0.7 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 12 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 18 N max. 1.2 N min. 3.75 mm 2 mm 0.7 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 16 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 24 N max. 1.6 N min. 4.55 mm 2 mm 0.7 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 20 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 30 N max. 2 N min. 5.35 mm 2 mm 0.7 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 24 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 36 N max. 2.4 N min. 6.15 mm 2 mm 0.7 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 30 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 45 N max. 3 N min. 7.35 mm 2 mm 0.7 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 50 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 75 N max. 5 N min. 11.35 mm 2 mm 0.7 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 10 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 15 N max. 1 N min. 4.5 mm 3.08 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 12 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 18 N max. 1.2 N min. 4.9 mm 3.08 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 16 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 24 N max. 1.6 N min. 5.7 mm 3.08 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 20 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 30 N max. 2 N min. 6.5 mm 3.08 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 24 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 36 N max. 2.4 N min. 7.3 mm 3.08 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 30 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 45 N max. 3 N min. 8.5 mm 3.08 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 40 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 60 N max. 4 N min. 10.5 mm 3.08 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 50 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 75 N max. 5 N min. 12.5 mm 3.08 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C

Notice


Status RoHS compliant REACH compliant
Contact pitch No. of positions Plug/ Receptacle
Number of rows Connection type PCB mounting method
Rated current (AC, DC) Rated voltage Contact resistance (initial)
Dielectric withstanding voltage Insulation resistance (initial) Material of contact
Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator
PCB boardlock feature Life time Total insertion force
Total extraction force Body length Body breadth
Body height Packing type Quantity in the standard packing
Operating temperature range Remarks