WP6C Series

NEED ASSISTANCE?

0.4mm pitch, Stacking type board-to-board (FPC) connector
Outline
 The WP6C Series is a low-profile stacking type board-to-board(FPC) connector with 0.4mm pitch spacing that is ideal for high-density mounting in slim information communication devices like mobile phones, smartphones, LCD and notebook PC.

 The WP6C Series has a shield structure that reduces noise during mating with a secure ground connection with its exclusive terminals on both four corners and with a shield equipped on the rear side of receptacle.

 Also, the mounting pattern of the WP6C Series are the same as the existing WP6 Series. Both type with and without shield are available.

* The mounting pattern is the same as the existing WP6 Series. (Not mateable)

Features
 0.4mm pitch, 2rows, stacking height 0.8mm.
 Contact structure ensures high wear-resistance and high contact reliability.
 Secure hold-downs prevent insulator breakage and peeling from FPC.
 2-point contact design to resist twisting stress.
 Enhanced ground connection during mating. and shield structure with .anti-noise measure.
 Lead-free. Nickel barrier on contact prevents solder wicking.

 Applications
Slim information communication devices like mobile phones, smartphones, LCD and notebook PC.

General Specifications

Number of positions24, 30 pos.
Pitch0.4 mm, 2 rows
CurrentAC, DC 0.3 A/ terminal
Rated voltageAC, DC 50 V
Contact resistance70 milliohm max. (initial)
Insulation resistance100 megohm min.
Dielectric withstanding voltage250 VACr.m.s. (1 minute)
Total insertion force1.5*n N max. (n: No. of pos.)
Total extraction force0.15*n N min. (n: No. of pos.)
Durability mating cycles30 mating cycles
Operating temperature range-40 deg. C to +85 deg. C

Product ListShow allCustomize

Status RoHS compliant REACH compliant Contact pitch No. of positions Plug/ Receptacle Number of rows Connection type PCB mounting method Rated current (AC, DC) Rated voltage Contact resistance (initial) Dielectric withstanding voltage Insulation resistance (initial) Material of contact Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator PCB boardlock feature Life time Total insertion force Total extraction force Body length Body breadth Body height Packing type Quantity in the standard packing Operating temperature range Remarks
Active Yes 0.4 mm ピッチ 24 pos. Plug 2 rows Stacking Soldering (SMT) 0.3A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 36 N max. 3.6 N min. 6.35 mm 2 mm 0.64 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 24 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 36 N max. 3.6 N min. 6.35 mm 2 mm 0.64 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 30 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 45 N max. 4.5 N min. 7.55 mm 2 mm 0.64 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 30 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 45 N max. 4.5 N min. 7.55 mm 2 mm 0.64 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 24 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 36 N max. 3.6 N min. 7.7 mm 3.08 mm 0.8 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 24 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 36 N max. 3.6 N min. 7.7 mm 3.08 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 30 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 45 N max. 4.5 N min. 8.9 mm 3.08 mm 0.8 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 30 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 30 mating cycles 45 N max. 4.5 N min. 8.9 mm 3.08 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C

Notice


Status RoHS compliant REACH compliant
Contact pitch No. of positions Plug/ Receptacle
Number of rows Connection type PCB mounting method
Rated current (AC, DC) Rated voltage Contact resistance (initial)
Dielectric withstanding voltage Insulation resistance (initial) Material of contact
Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator
PCB boardlock feature Life time Total insertion force
Total extraction force Body length Body breadth
Body height Packing type Quantity in the standard packing
Operating temperature range Remarks