WP9 Series

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0.4mm pitch, Stacking type board-to-board (FPC) connector

Outline
 The WP9 series is a space saving low-profile board-to-board (FPC) connector with 0.4mm pitch spacing that is ideal for high-density mounting in slim information communication devices like mobile phones, smartphones and notebook PCs.

Features
- 0.4mm pitch, 2rows, 0.8mm stacking height and 1.95mm depth
- Contact structure ensures high wear-resistance and high contact reliability.
- Secure hold-downs prevent insulator breakage and peeling from FPC.
- 2-point contact design to resist twisting stress.
- Lead-free, Nickel barrier on contact prevents solder wicking.
- Inspection jig connector for both plug and receptacle are available. (Note 1)

Applications
 Information communication devices like mobile phones, smartphones and notebook PCs.

Note 1) Please contact us for details on inspection jig connector specifications.

General Specifications

Number of positions10, 14, 20, 24, 30, 32, (34), 40, (50), 60 pos.
* ( ) are planned to be developed.
Pitch0.4 mm, 2 rows
CurrentAC, DC 0.3 A/ terminal
Rated voltageAC, DC 50 V
Contact resistance70 milliohm max. (initial)
Insulation resistance100 megohm min. (initial)
Dielectric withstanding voltage250 VACr.m.s. (1 minute)
Total insertion force1.2*n N max. (n: No. of pos.)
Total extraction force0.15*n N min. (n: No. of pos.)
Durability mating cycles50 mating cycles
Operating temperature range-40 deg. C to +85 deg. C

Product ListShow allCustomize

Status RoHS compliant REACH compliant Contact pitch No. of positions Plug/ Receptacle Number of rows Connection type PCB mounting method Rated current (AC, DC) Rated voltage Contact resistance (initial) Dielectric withstanding voltage Insulation resistance (initial) Material of contact Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator PCB boardlock feature Life time Total insertion force Total extraction force Body length Body breadth Body height Packing type Quantity in the standard packing Operating temperature range Remarks
Active Yes 0.4 mm ピッチ 10 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 12 N max. 1.5 N min. 3.35 mm 1.7 mm 0.65 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 10 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 12 N max. 1.5 N min. 3.35 mm 1.7 mm 0.65 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 14 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 16.8 N max. 2.1 N min. 4.15 mm 1.7 mm 0.65 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 14 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 16.8 N max. 2.1 N min. 4.15 mm 1.7 mm 0.65 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 20 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 24 N max. 3 N min. 5.35 mm 1.7 mm 0.65 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 20 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 24 N max. 3 N min. 5.35 mm 1.7 mm 0.65 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 24 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 28.8 N max. 3.6 N min. 6.15 mm 1.7 mm 0.65 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 24 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 28.8 N max. 3.6 N min. 6.15 mm 1.7 mm 0.65 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 30 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 36 N max. 4.5 N min. 7.35 mm 1.7 mm 0.65 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 30 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 36 N max. 4.5 N min. 7.35 mm 1.7 mm 0.65 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 32 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 38.4 N max. 4.8 N min. 7.75 mm 1.7 mm 0.65 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 32 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 38.4 N max. 4.8 N min. 7.75 mm 1.7 mm 0.65 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 40 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 48 N max. 6 N min. 9.35 mm 1.7 mm 0.65 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 40 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 48 N max. 6 N min. 9.35 mm 1.7 mm 0.65 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 60 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 72 N max. 9 N min. 13.35 mm 1.7 mm 0.65 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 60 pos. Plug 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 72 N max. 9 N min. 13.35 mm 1.7 mm 0.65 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 10 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 12 N max. 1.5 N min. 4.5 mm 1.95 mm 0.8 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 10 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 12 N max. 1.5 N min. 4.5 mm 1.95 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 14 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 16.8 N max. 2.1 N min. 5.3 mm 1.95 mm 0.8 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 14 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 16.8 N max. 2.1 N min. 5.3 mm 1.95 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 20 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 24 N max. 3 N min. 6.5 mm 1.95 mm 0.8 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 20 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 24 N max. 3 N min. 6.5 mm 1.95 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 24 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 28.8 N max. 3.6 N min. 7.3 mm 1.95 mm 0.8 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 24 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 28.8 N max. 3.6 N min. 7.3 mm 1.95 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 30 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 36 N max. 4.5 N min. 8.5 mm 1.95 mm 0.8 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 30 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 36 N max. 4.5 N min. 8.5 mm 1.95 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 32 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 38.4 N max. 4.8 N min. 8.9 mm 1.95 mm 0.8 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 32 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 38.4 N max. 4.8 N min. 8.9 mm 1.95 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 40 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 48 N max. 6 N min. 10.5 mm 1.95 mm 0.8 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm ピッチ 40 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 48 N max. 6 N min. 10.5 mm 1.95 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 60 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 72 N max. 9 N min. 14.5 mm 1.95 mm 0.8 mm Embossed tape packaging 500 pieces/reel -40 deg. C to +85 deg. C
Active Yes 0.4 mm pitch 60 pos. Receptacle 2 rows Stacking Soldering (SMT) 0.3 A/terminal AC, DC 50V 70 milliohm max. AC 250 Vr.m.s. 1minute 100 megohm min. Copper alloy Gold plating Gold plating Heat-resistant plastic Hold-down 50 mating cycles 72 N max. 9 N min. 14.5 mm 1.95 mm 0.8 mm Embossed tape packaging 6000 pieces/reel -40 deg. C to +85 deg. C

Notice


Status RoHS compliant REACH compliant
Contact pitch No. of positions Plug/ Receptacle
Number of rows Connection type PCB mounting method
Rated current (AC, DC) Rated voltage Contact resistance (initial)
Dielectric withstanding voltage Insulation resistance (initial) Material of contact
Finish of contact in connecting area Finish of contact in PCB mounting area Material of insulator
PCB boardlock feature Life time Total insertion force
Total extraction force Body length Body breadth
Body height Packing type Quantity in the standard packing
Operating temperature range Remarks