XFMEXPRESS™ Memory Device Connector SN01 Series (Under Development)
Recently, requirements for larger storage capacity in a small package are growing for ICT devices. Therefore, JAE is developing the SN01 Series connector for XFMEXPRESS memory devices. XFMEXPRESS is a removeable NVMe memory device technology developed by KIOXIA Corporation, formerly Toshiba Memory Corporation, for PC’s, IoT devices and various other mobile applications. The SN01 Series connector is compatible with up to 4 lanes of PCIe® Gen 4 (16GT/s) high speed data, and uses a hinge type cover to securely hold the memory device while maintaining a compact size.
JAE will continue to provide connectors that meet customer needs for next-generation high-speed transmission and miniaturization.
Note1) PCIe is a registered trademark of PCI-SIG
Note2) PCIe Gen 4 : Peripheral Component Interconnect Express
- Hinge type mechanism is easy to operate in a small space
- Reliable lock structure prevents cover from opening if device is dropped
- Enhanced heat dissipation structure
- Contact design compatible with high speed transmission
|Contact Resistance||100ｍΩ max.|
|Voltage Proof||AC500 Vr.m.s. for 1 minute|
|Insulation Resistance||100ＭΩ min.|
|Operating Temperature Range||-25℃～+85℃|
For more information on KIOXIA Corporation, formerly Toshiba Memory's XFMEXPRESS™ click here
For more information on XFMEXPRESS™ Memory Device Connector click here
Information and details given here are as of the date of publication.
Please note that the details may be changed.